Nombor Bahagian : | HF115AC-0.0055-AC-90 |
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Pengilang / jenama : | Bergquist |
Penerangan : | THERM PAD 21.84MMX18.79MM W/ADH |
Status RoHS : | Lead percuma / RoHS Compliant |
Kuantiti Tersedia | 957695 pcs |
Helaian data | HF115AC-0.0055-AC-90.pdf |
penggunaan | TO-218, TO-220, TO-247 |
Jenis | Pad, Sheet |
ketebalan | 0.0055" (0.140mm) |
Resistivity Thermal | 0.35°C/W |
Kekonduksian terma | 0.8 W/m-K |
bentuk | Rectangular |
Siri | Hi-Flow® 115-AC |
Rangka | 21.84mm x 18.79mm |
Nama lain | BER169 BG428814 HF115AC-90 HF115AC00055AC90 HF115TAAC-90 |
Tahap Sensitiviti Lembapan (MSL) | 1 (Unlimited) |
bahan | Phase Change Compound |
Pengilang Standard Lead Time | 2 Weeks |
Status Status Percuma / Rosh Status | Lead free / RoHS Compliant |
Penerangan terperinci | Thermal Pad Gray 21.84mm x 18.79mm Rectangular Adhesive - One Side |
warna | Gray |
Sokongan, Carrier | Fiberglass |
pelekat | Adhesive - One Side |