Nombor Bahagian : | HF115AC-0.0055-AC-105 |
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Pengilang / jenama : | Bergquist |
Penerangan : | THERM PAD 36.83MMX21.29MM W/ADH |
Status RoHS : | Lead percuma / RoHS Compliant |
Kuantiti Tersedia | 564778 pcs |
Helaian data | HF115AC-0.0055-AC-105.pdf |
penggunaan | SIP |
Jenis | Pad, Sheet |
ketebalan | 0.0055" (0.140mm) |
Resistivity Thermal | 0.35°C/W |
Kekonduksian terma | 0.8 W/m-K |
bentuk | Rectangular |
Siri | Hi-Flow® 115-AC |
Rangka | 36.83mm x 21.29mm |
Nama lain | BER170 HF115AC-105 HF115AC00055AC105 HF115TAAC-105 |
Tahap Sensitiviti Lembapan (MSL) | 1 (Unlimited) |
bahan | Phase Change Compound |
Pengilang Standard Lead Time | 2 Weeks |
Status Status Percuma / Rosh Status | Lead free / RoHS Compliant |
Penerangan terperinci | Thermal Pad Gray 36.83mm x 21.29mm Rectangular Adhesive - One Side |
warna | Gray |
Sokongan, Carrier | Fiberglass |
pelekat | Adhesive - One Side |