Nombor Bahagian : |
XCZU17EG-3FFVC1760E |
Pengilang / jenama : |
Xilinx |
Penerangan : |
IC FPGA 512 I/O 1760FCBGA |
Status RoHS : |
Lead percuma / RoHS Compliant |
Kuantiti Tersedia |
4 pcs |
Helaian data |
XCZU17EG-3FFVC1760E.pdf |
Pembekal Peranti Pakej |
1760-FCBGA (42.5x42.5) |
Speed |
600MHz, 667MHz, 1.5GHz |
Siri |
Zynq® UltraScale+™ MPSoC EG |
RAM Saiz |
256KB |
sifat utama |
Zynq®UltraScale+™ FPGA, 926K+ Logic Cells |
Peripherals |
DMA, WDT |
pembungkusan |
Tray |
Pakej / Kes |
1760-BBGA, FCBGA |
Suhu Operasi |
0°C ~ 100°C (TJ) |
Bilangan I / O |
512 |
Tahap Sensitiviti Lembapan (MSL) |
4 (72 Hours) |
Pengilang Standard Lead Time |
20 Weeks |
Status Status Percuma / Rosh Status |
Lead free / RoHS Compliant |
Saiz flash |
- |
Penerangan terperinci |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 System On Chip (SOC) IC Zynq® UltraScale+™ MPSoC EG Zynq®UltraScale+™ FPGA, 926K+ Logic Cells 256KB 600MHz, 667MHz, 1.5GHz 1760-FCBGA (42.5x42.5) |
Processor Core |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Kesambungan |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Architecture |
MCU, FPGA |