| Nombor Bahagian : | 232-1287-00-0602J |
|---|---|
| Pengilang / jenama : | 3M |
| Penerangan : | CONN IC DIP SOCKET ZIF 32POS GLD |
| Status RoHS : | Lead percuma / RoHS Compliant |
| Kuantiti Tersedia | 1555 pcs |
| Helaian data | 1.232-1287-00-0602J.pdf2.232-1287-00-0602J.pdf |
| Jenis | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Penamatan Post Negara | 0.110" (2.78mm) |
| penamatan | Press-Fit |
| Siri | Textool™ |
| Pitch - Post | 0.100" (2.54mm) |
| Pitch - Mengawan | 0.100" (2.54mm) |
| pembungkusan | Bulk |
| Nama lain | 0 51138 76490 6 2003207282-000006002 2321287000602J 3M3206 3M3206-ND 3M5005 5113876490 51138764906 5400767592 54007675921 7000007359 80-6103-5018-5 80610350185 JE150148672 |
| Suhu Operasi | -55°C ~ 125°C |
| Bilangan Jawatan atau Pins (Grid) | 32 (2 x 16) |
| pemasangan Jenis | Connector |
| Tahap Sensitiviti Lembapan (MSL) | 1 (Unlimited) |
| Bahan Terbakar Rating | UL94 V-0 |
| Pengilang Standard Lead Time | 8 Weeks |
| Status Status Percuma / Rosh Status | Lead free / RoHS Compliant |
| perumahan bahan | Polysulfone (PSU), Glass Filled |
| ciri-ciri | Closed Frame |
| Rating Semasa | 1A |
| hubungan rintangan | 15 mOhm |
| Hubungi bahan - Post | Beryllium Copper |
| Hubungi bahan - Mengawan | Beryllium Copper |
| Cara Selesai Ketebalan - Post | 30.0µin (0.76µm) |
| Cara Selesai Ketebalan - Mengawan | 30.0µin (0.76µm) |
| Cara Selesai - Post | Gold |
| Cara Selesai - Mengawan | Gold |
3M
